Censtar OB-P618 ເຄື່ອງພິມ Semi-auto Solder Paste

Dimension: 850*670*1550mm

Platform size: 320*400mm

PCB size: 300*400mm

Stencil size: 550*680mm

Printing speed: 0-8000mm/Min

PCB thickness: 0-100mm

Power supply: 1P AC220V, 50/60HZ

Platfrom height: 880mm

Repeatability: (+/-0.01mm)

Table fine-tuning: Front/back±10mm; Right/Left±10mm

Printing accuracy: ±0.05mm

Machine repeatability: ±0.02mm

Use air pressure: 4-7kg/cm2

Positioning mode: Outside/Reference hole

Weight: 270kg

This equipment is used for the solder paste and red glue printing of PCB boards in the SMD production line hindrance.

Features

1.High precise slide rail printing precise is uo to 0.2mmlC

2.PLC+touchscreen+frequency inverter controller

3. Magnetic thimble + honeycomb board platform, more suitable for double sides PCB

4.Scrape angle, pressure, trave length are adjustable

5.X/YIZ axis can fine turning, high precise