ຮັບສ່ວນຫຼຸດພິເສດຕາມປະລິມານ, ອັບເດດລາຄາຂາຍສົ່ງ ແລະ ການແຈ້ງເຕືອນສິນຄ້າໃໝ່ສົ່ງກົງເຖິງອິນບັອກຂອງທ່ານ.
ໂດຍການສະໝັກສະມາຊິກ, ທ່ານຍອມຮັບ ເງື່ອນໄຂການໃຫ້ບໍລິການ ແລະ ນະໂຍບາຍຄວາມເປັນສ່ວນຕົວ ຂອງພວກເຮົາ.
ເຂົ້າເຖິງຜູ້ຊ່ຽວຊານທີ່ໄດ້ຮັບການຢັ້ງຢືນຂອງພວກເຮົາໂດຍກົງ
Exposure System
Exposure Modes: Vacuum contact
Resolution: ≤2.0μ
Exposure Modes: Hard contact
Resolution: 2.0-3.0μ
Exposure Modes: Soft contact
Resolution: 3.0 – 5.0μ
Exposure Modes: Proximity (20μ gap)
Resolution: 5.0μm
Advanced Beam Optics
Long working distance light source allows for all fixed optical components and more exposures
Uniform Beam Size: 12” – 20” square
Lamp Power: 1KW – 8KW
Uniformity: Better than ±3 to 5%
Camera: 4MP Dual Camera GigE with large field of view
Alignment System
Pattern Recognition: OAI’s enhanced pattern recognition software
Alignment Accuracy: 0.5μ topside and 1.0μ with top to bottom optional backside alignment
Auto-alignment:
Top to bottomside
Topside
Wafer Handling
Substrate size : 12”sq to 20”sq
Mask size: 14”sq to 24”sq
Thin substrates: 1mm
Thick & Bonded
Substrates: Up to 5000μm
Stepper Chuck (Option): Multiple steps (customized)
Run-out compensation: Standard software or optional thermal chuck
Wedge Effect Leveling: 3 point or optional non-contact laser gap measurement
