Samtec APM6-060-06.5-L-04-2-A-TR Headers 0.635 mm 间距 AcceleRate HP 高性能阵列端子

Pitch: 0.635 mm (0.025 in)

Data Rate: 56 Gbps

Stack Height: 10 mm

Current Rating: 1.34 A

Mounting Angle: Straight

Mounting Style: SMD/SMT

Number of Rows: 4 Row

Voltage Rating: 155 VAC

Contact Plating: Gold

Contact Material: Copper Alloy

Housing Material: Liquid Crystal Polymer (LCP)

Maximum Data Rate: 56 Gbps

Termination Style: Solder Balls

Number of Positions: 240 Position

Maximum Operating Temperature: + 125 C

Minimum Operating Temperature: - 55 C