Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.
By subscribing, you agree to our Terms of Service and Privacy Policy.
Direct access to our certified experts
Pitch: 0.635 mm (0.025 in)
Data Rate: 112 Gbps
Mounting Angle: Vertical
Number of Rows: 4 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 112 Gbps
Termination Style: Solder Balls
Number of Positions: 100 Position
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
