3M Electronic Solutions Division 232-1285-29-0602J DIPソケット用DIPソケット受け 32接点 数量

Pitch: 2.54 mm

Row Spacing: 15.24 mm

Unit Weight: 25 g

Current Rating: 1 A

Number of Rows: 2 Row

Contact Plating: Gold

Contact Material: Beryllium Copper

Housing Material: Polysulfone

Termination Style: Solder Pin

Flammability Rating: UL 94 V-0

Number of Positions: 32 Position

Maximum Operating Temperature: + 125 C

Minimum Operating Temperature: - 55 C