Censtar MP300 PCB多層プレス機

Technical Parameters

Maximum wiring size: 285*205mm

Maximum lamination area: 305*230mm

Maximum lamination strength: 300N/CM²

Maximum temperature: 250℃

The number of boards that can be pressed at the same time: 2

Number of circuit board layers: maximum 8 layers

Power supply: 220V/50HZ

Weight: 180kg

Features

It is used for thermosetting and thermoplastic material thermocompression, especially suitable for thermoforming sheet. It is designed for single-piece and extremely small batch production of high-precision and special multi-layer PCBs, especially suitable for high-frequency substrates, LCP and other materials with high pressing temperature, and also suitable for hot-pressing processing of other thermoplastic and thermosetting materials, such as resistance Solder film, graphite, etc. Compact design, matched with reliable electric control, automatic hydraulic, automatic air blowing and cooling system, and standard process monitoring software to ensure perfect and excellent performance.