Samtec APF6-025-03.5-S-04-2-L-TR ソケット 0.635 mm ピッチ AcceleRate(R) HP 高性能アレイソケット

Pitch: 0.635 mm (0.025 in)

Data Rate: 112 Gbps

Mounting Angle: Vertical

Number of Rows: 4 Row

Contact Plating: Gold

Contact Material: Copper Alloy

Housing Material: Liquid Crystal Polymer (LCP)

Maximum Data Rate: 112 Gbps

Termination Style: Solder Balls

Number of Positions: 100 Position

Maximum Operating Temperature: + 125 C

Minimum Operating Temperature: - 40 C