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数量割引、まとめ買い価格の更新、新製品情報をメールでお届けします。
登録することで、当社の利用規約およびプライバシーポリシーに同意したものとみなされます。
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- General technical data:
Overall dimension(mm) (Not include the keyboard, indicator light and monitor): 2710(L)*1670(W)*1630(H)
Equipment Weight(kg): 2200
PCB size(mm): 510(L)*450(W)
Min PCB size(mm): 120(L)*50(W)
Minimum distance between nozzle center of the two solder pots(mm): 95
PCB Top Side Clearance (mm): 120
PCB Bottom Side Clearance (mm): 40
PCB process edge (mm): ≥3
Conveyor Height From Floor (mm): 850±25
PCB Conveying Speed (mm/s): 0.2-10
Max PCB Weight (kg): ≤5
PCB Thickness With Jig (mm): 1-6
Conveyor Width Adjustment Range (mm): 50-450
Conveyor Width Adjustment Mode: Electric
PCB Conveying Direction: Left to right
Air Input Pressure (Mpa): 0.6
Max Air Consumption(m³/h): 5
Nitrogen Supply: Offered by customer
Nitrogen Input Pressure (Mpa): 0.6
Nitrogen Consumption (m³/h): 1.5/singles older pot
Required Purity of Nitrogen (%): ≥99.999
Exhaust Volume (m³/h): 150*2
Supply Voltage (VAC): 380
Frequency (HZ): 50/60
Max Power Consumption (kw): ≤31
Max Current (A): <60
Ambient Temperature (℃): 10-35
Machine Noise Leve (dB): ≤65
Communication Interface: SMEMA
- Soldering module:
Max.Soldering distance of X axis(mm): 510
Max.Soldering distance of Y axis(mm): 450
Max.Soldering distance of Z axis(mm): 40
Min outer diameter of nozzle (mm): 5.5
Nozzle inner diameter (mm): 2.5-10
Max soldering wave height (mm): 5
Solder pot capacity(kg): Approx.13kg/ Approx.12kg(lead-free)
Max soldering temperature (℃): 330
Soldering heating power (kw): 1.15/solder pot
- Preheating module:
Preheat temperature range(℃) : <200
Heating power (kw) : 24
Heating mode: Hot air+Infrared
Topside preheating: Hot air
- Spraying System:
Max.stroke of X axis(mm): 510
Max.stroke of Y axis (mm) : 450
Spray height(mm): 60
Location speed (mm/s): <400
Spray head automatically cleaning: Program control
Fluxbox capacity (L): 2
Catalog
