3M Electronic Solutions Division 8468-21B1-RK-TP 칩 캐리어 68P PLCC 소켓 SMT W/O LOC 포스트
Model8468-21B1-RK-TP
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Pitch: 1.27 mm
Features: MO-047
Row Spacing: 20.32 mm
Unit Weight: 2.800 g
Mounting Style: SMD/SMT
Number of Rows: 4 Row
Contact Plating: Tin
Contact Material: Copper Alloy
Housing Material: Polybutylene Terephthalate (PBT)
Termination Style: Solder Pad
Flammability Rating: UL 94 V-0
Number of Positions: 68 Position
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
