ຮັບສ່ວນຫຼຸດພິເສດຕາມປະລິມານ, ອັບເດດລາຄາຂາຍສົ່ງ ແລະ ການແຈ້ງເຕືອນສິນຄ້າໃໝ່ສົ່ງກົງເຖິງອິນບັອກຂອງທ່ານ.
ໂດຍການສະໝັກສະມາຊິກ, ທ່ານຍອມຮັບ ເງື່ອນໄຂການໃຫ້ບໍລິການ ແລະ ນະໂຍບາຍຄວາມເປັນສ່ວນຕົວ ຂອງພວກເຮົາ.
ເຂົ້າເຖິງຜູ້ຊ່ຽວຊານທີ່ໄດ້ຮັບການຢັ້ງຢືນຂອງພວກເຮົາໂດຍກົງ
ຮັບສ່ວນຫຼຸດພິເສດຕາມປະລິມານ, ອັບເດດລາຄາຂາຍສົ່ງ ແລະ ການແຈ້ງເຕືອນສິນຄ້າໃໝ່ສົ່ງກົງເຖິງອິນບັອກຂອງທ່ານ.
ໂດຍການສະໝັກສະມາຊິກ, ທ່ານຍອມຮັບ ເງື່ອນໄຂການໃຫ້ບໍລິການ ແລະ ນະໂຍບາຍຄວາມເປັນສ່ວນຕົວ ຂອງພວກເຮົາ.
ເຂົ້າເຖິງຜູ້ຊ່ຽວຊານທີ່ໄດ້ຮັບການຢັ້ງຢືນຂອງພວກເຮົາໂດຍກົງ
Scope of delivery
1x P1202 L-ESD, ESD Magnetic Field Source Langer Pulse 0.2/2.5 ns
1x P1301 L-ESD, ESD E-Field Source Langer Pulse 0.2/5.5 ns
1x BPS 203, Burst Power Station
1x BPS 203-Client, Control Software
1x BPM 02, dB/dt Field Meter
1x EPM 02, dE/dt Field Meter
2x SMA-SMB 1 m, SMA-SMB Measuring Cable
1x HV FI-FI 1 m, High-Voltage Cable, Fischer-Fischer
1x FBK 12P 1m, Control Cable
1x USB-AB, USB Cable Type A-B
1x D70 h03, Spacer Ring, 3 mm
1x D70 h10, Spacer Ring, 10 mm
1x FKE 30, Field Chamber Insert
1x NT Ex EU, Power Supply Unit
1x P1202 / P1301 acc, Accessories
1x P1202 / P1301 case, System Case
1x P1202 / P1301 m, P1202 / P1301 Set User Manual
Short description
The field sources, which are included in the probe set field coupling 200 ps Langer ESD, generate very fast electric and magnetic ESD pulse fields. With these fields, ICs are defined and reproducibly pulsed to determine their immunity against ESD fields.
The reason for this is the ESD immunity of PC boards and electrical devices. The immunity is tested (IEC 61000-4-2). During the tests, standard ESD pulse fields and very fast electric and magnetic fields (200 ps) are generated by coupled ESD interference into the PC boards. These fields affect the PC board surface and penetrate the IC casings. If fields penetrate the ICs, disturbance events will be generated. The IC interference via magnetic or electrical fields is a significant source of interference path in addition to conducted coupling of ESD interference above the ICs.
From the probe set, knowledge will be gained of the IC EMC behaviour and this can be streamlined into the development of the PC board.
Expensive redesigns are avoided and development costs are reduced.
Furthermore, the use of the test methods for the determination of IC EMC parameters enables the IC producer to develop ICs more efficiently.
The test set-up needs the ICE1 test system and external devices.
Datasheet
Manual