Trạm tháo, hàn BGA/SMT Manncorp RW1210
Kích thước PCB (Min): 50 mm x 10 mm (2" x 0.4")
Kích thước PCB Size (Max): 430 mm x 360 mm (17" x 14.25")
Độ dày PCB: 0.8 mm - 3 mm (0.032" to 0.12")
Kích thước linh kiện (Min): 2 mm x 2 mm (0.08" x 0.08")
Kích thước linh kiện (Maxm): 55 mm x 55 mm (2.16" x 2.16")
Min BGA Ball/QFP Lead Pitch: 0.3 mm (0.012")
Gia nhiệt linh kiện (lớp trên): không khí nóng (1200 W)
Gia nhiệt linh kiện (lớp dưới): không khí nóng(1200 W)
Gia nhiệt dưới: nhanh IR (2700 W)
Điều khiển nhiệt độ: kiểu K, PID
Nguồn:220 V ± 10%/ Single Phase, 50/60 Hz
Tổng công suất tiêu thụ: 5.3 KW Max.
Kích thước: 640 mm L x 630 mm W x 900 mm H
Trọng lượng: 68 Kg (150 lbs.)
Cung cấp bao gồm: 1 máy RW1210, 1 đầu típ thổi 35 mm x 35 mm, 01 đâu thổi, 55 mm x 55 mm, 01 bộ vòi hút chân không (2 mm, 4 mm, 8 mm, 10 mm, 16 mm)
1 dây đo nhiệt độ kiểu K, 4 cái giữ chân PCB, 1 bộ tools kit
Option:
NOZ7x7: Topside nozzle 7 mm x 7mm for BR series
NOZ8x8: Topside nozzle 8 mm x 8 mm for BR series
NOZ9x9: Topside nozzle 9 mm x 9 mm for BR series
NOZ12x12: Topside nozzle 12 mm x 12 mm for BR series
NOZ15x15 :Topside nozzle 15 mm x 15 mm for BR series
NOZ18x18 :Topside nozzle 18 mm x 18 mm for BR series
NOZ20x20 :Topside nozzle 20 mm x 20 mm for BR series
NOZ21x21 :Topside nozzle 21 mm x 21 mm for BR series
NOZ24x24 :Topside nozzle 24 mm x 24 mm for BR series
Details
1.3 Million Pixel, High-Definition, Split-Vision Optics
Another of the RW1210 Manncorp-exclusive features is the superior quality of its 1.3 million pixel, split-vision CCD camera and 15” 1080p LCD display with HDMI input. 230x joystick-controlled zoom, and independent adjustment of high-brightness LED lighting for the component and PCB, allow ultra-clear, superimposed views of component leads and PCB solder pads. The RW1210 is the only rework system in its price range to include true high-definition vision that is on a par with the industry most advanced, high-end rework systems.
High-Precision X, Y, and θ-Axes Alignment Micrometers
With the RW1210 HD optics providing crisp, clear, superimposed views of the PCB and component, ultra-fine X- and Y- axis micrometers on the board holding fixture, and another on the pick-up head for the θ-axis, allow fast, easy, and precise alignment of leads to pads. In conjunction with the RW1210 extraordinary Z-axis precision and drift-free optical calibration, these features ensure the alignment and ±0.01mm placement accuracy needed for 0.3 mm (0.012") lead pitch µBGAs and QFPs.
Exclusive Touchscreen User Interface and Ergonomic Design
The RW1210 user-friendly touchscreen control software is just one of many Manncorp-exclusive features that set it apart from other rework systems in its class. An ergonomically-designed instrument panel includes joystick control for both the alignment camera zoom and the up/down motion of the upper heater/placement head when in the manual mode. Dial adjustments are conveniently located for component and PCB lighting, as well as control of the upper heater hot air flow to prevent shifting of small chip components during reflow. The control panel also includes a built-in K-type thermocouple input and USB port for exporting temperature profiles to a flash drive.
Versatile PCB Holder Accommodates Wide Range of Boards
The RW1210 universal board holding fixture adjusts quickly and easily to provide a firm grip on virtually any PCB from 50 mm x 10 mm (2" x 0.4") to 430 mm x 360 mm (17" x 14.25"), and with a thickness from 0.8 mm - 3 mm (0.032" to 0.12"). Its high precision edge rails and slide bearings allow easy positioning of the component between the top and bottom heaters, while convenient thumbscrews securely lock the board in place when everything is set. An additional set of rails and adjustable pins provide positive support from the PCB underside when needed.
“Rapid IR” Underheater Eliminates Thermal Stress
The RW1210 hot air bottom heater is surrounded by a 2700W, 350 mm x 250 mm (13.75" x 10") “Rapid IR” underheater that quickly and efficiently heats the bottom surface of the PCB. Raising the temperature of the entire board prevents board warpage and reduces stress on components and solder joints adjacent to the rework site. It also reduces overall cycle times and maximum temperature exposure. For operator safety and reduced maintenance, the infrared heaters are fully enclosed in a glass-shielded compartment that quickly dissipates heat, prevents debris from falling into the elements, and is easy to keep clean.
Easy PCB and Component Positioning with Convenient Laser Pointer
A handy laser pointer is mounted adjacent to the upper heater assembly and is targeted at the virtual intersection of the PCB surface and the RW1210 Z-axis. During setup, the operator simply positions the PCB in the board holding fixture so that the laser dot is centered over the component to be reworked. This ensures that the bottom heater, component, and upper heater are properly aligned and dramatically reduces setup time.
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