Trạm hàn BGA ShuttleStar SV550A | EMIN.VN

Trạm hàn BGA ShuttleStar SV550A

Name: Trạm hàn BGA ShuttleStar SV550A
Brand: Shuttlestar

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Hãng sản xuấtShuttlestar

ModelSV550A

Liên hệ

Số lượng

Thanh toán an toàn

Hỗ trợ chuyên nghiệp

Đổi trả dễ dàng

Giao hàng tận nơi

Kích thước PCB : W20*D20~W550*500
Độ dày PCB : 0.5~4mm
Điều chỉnh bàn làm việc: Trước/sau ±120mm , Trái/ phải ±80mm
Điều khiển nhiệt độ: Cặp nhiệt kế kiểu K, vòng kín
Bộ sấy ( hồng ngoại): 3600W
Bộ nhiệt trên ( khí nóng ): 1200W
Bộ nhiệt dưới ( khí nóng ): 800W
Nguồn cung: 1 pha 220V, 50/60Hz
Kích thước & trọng lượng BGA: 1*1~70*70mm; 300g
Kích thước máy: L850*W750*H630
Trọng lượng: khoảng 80kgs

Features:

Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently,
time and temperature can be displayed digitally on touch screen;
Optical vision system can move along with X、Y axis automatically;
easy for placement and operation;
Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly,
the max PCB size ,it can handle up to 550×500mm;
Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
Color optical system with functions of split vision, zoom in/out and micro-adjust,
equipped with aberration detection device; with auto focus and software operation function,
27 X optical focus, able to rework BGA sized up to 70×70mm;
Embedded industrial computer, touch screen interface, PLC control, real-time profile display,
able to display set profile and 5 practically tested profile at the same time;
can analyze the five practically-tested profiles, and compare them with the history saved profiles;
with USB for connecting mouse and updating software;
Color LCD monitor; big size screen, easy to operate;
Built-in vacuum pump; the max suction up to 80g；
60 °rotation in φ angle, 8 segments of temperature up(down) and 8 segments constant temperature control,
profile saving is unlimited in the industrial computer;
Suction nozzle can identify material and mounting height automatically,
and can control the air pressure within a small range;
Auto pick up chip, auto solder, auto remove, auto placement;
Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
Visible monitoring system, can view the melting procee of the balls,(optional).