SPIROX MA6503D 微检测系统 (300μm ~ 2000μm, 8- and 12-inch wafer)

Function

Replace QC visual inspection on surface defects

Auto-storing wafer surface defects image and position coordinate records

Wafer

Compatible with 8-inch and 12-inch Wafer

Wafer Thickness: 300μm ~ 2000μm

Wafer Handling

Support automatic opening function for 12-inch FOUP cassette

Wafer ID Scan

Pre-aligner (Notch Location)

Chuck

Support wafer leveling function

Stage Flatness < 15μm

X/Y Axis Accuracy: ±1.7μm

Wafer Alignment

Optical

Camera: Line scan camera with 3x lens

FOV: Scanning length of 24mm x 300mm

2D Image Inspection

Minimum Defect Size: 5μm (Gray > 30)

Discoloration Inspection

Scratches Inspection

Contamination Inspection

Process Defects Inspection

Support PMI (Probe Mark Inspection) Scan Function

3D Image Inspection

Z-axis Resolution: 5μm

Measurement of Bump height and coplanarity (Ball High Limit: 800μm)

Software

Compatible with Wafer ID OCR

Output Format: .bmp or .jpg

Online Review System

Defect Image Output Format: SINF File

Optional

Offline Review System

Customized Report

Feature:

Utilize a Line Scan Camera with wide FOV and fast scanning capabilities

Use a 3x lens to enhance image quality and improve the defect characteristics inspection

5μm Defects Inspection Items: Particles, Scratches, Pad Defects, Bump Defects

Support Probe Mark Inspection (PMI) and offer PAD quick selection for detection settings

Support 3D inspection to measurement of Bump height and coplanarity

Auto wafer-level chuck with ±1.7μm accuracy to process high accuracy wafer coordinate alignment

Zoning parameter setting to realize accurate inspection requirement by zones