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Leaptronix LP-ARM9-2410-SYSTEM ARM芯片系统设计与实验平台

  • 制造商: LEAPTRONIX
    Model: LP-ARM9-2410-SYSTEM
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Manufacturer:  Leaptronix
Model: LP-ARM9-2410-SYSTEM
详细

  Datasheet

ARM Chip System Design & Experiment Platform
Bring You into System & Embedded World


Introduction

Samsung S3C2410 is maturest in the ARM9 chip family, e.g. technical documents, referring books, supported systems, peripheral devices... and so rich and diversification. It can be said that it the best choice for learning ARM SYTEM. The LP-ARM9-2410-SYTEM provides simple design which allow you to quickly access SOC world, as well as laid good basis of the ability and practical experience for the embedded design.
 
Moreover, the LP-ARM9-2410-SYTEM compact structure with 3.5 inch touchscreen LCD, 10/100M Ethernet, USB, 250,000 logic gate FPGA and integrity of peripheral interface allow you to easily understand SYTEM and Embedded. And you can use this platform for project development and products systematic.
 
Features
  • Support Samsung S3C24C10 x 32-bits RISC Microprocessor which is under SARM920T frame.
  • Use Xilinx Spartan-3E FPGA XC3S250E PQFP208 which contains 250,000 logic gate counts. Let you process ARM+FPGA experiments or topic research. 
  • Modular design, able to change other CUP boards for learning.
  • Provide BootLoader function, able to use C or Assembly for writing Language, via the cable to download to the LP-2900 platform for experiment and verification.
  • Able to connect to PC via RS-232 interface. Use the simple terminal program for control and process program download and execute.
  • Provide JTAG interface, when writing the program, able to use ADS or RealView for single step trace and debug.
  • Provide logic analyzer interface, able to view the SPI, I2C, UART and PWM waveform for analysis. If you use Leaptronix LA or PLA, you can view the protocol decoder as well.
  • If you already have LP-2900, you just purchase LP-ARM9-2410 module for upgrade to ARM9 training kit. 
Specifications
  • CPU:SAMUNG S3C24C10x
  • Memory:
    • SDRAM FLASH 4MBytes
    • NOR FLASH 4MBtyes
    • NAND FLASH 64MBytes
  • Display:3.5 inch TFT LCD, 320 X 240 pixels
  • Touch interface:4 line resistance type
  • Net interface:10 / 100M Ethernet
  • Communication interface:RS-232
  • Sound interface:
    • IIS sound interface chip, Stereo audio output interface
    • Microphone input interface
  • JTAG interface:ARM standard JTAG interface
  • FPGA:XILINX XC3S250E PQFP208
  • Button:5 button key
  • Power:100V AC~240V AC (Auto-Switching), 50/60Hz
  • Dimension:32cm x 22.6cm x 3.0 / 8.56cm
  • Weight:500g
  • Operation altitude:up to 5000m
  • Operation humidity:20% ~ 70%(non-condensing)
  • Operation Temperature:+5˚C ~ +45˚C
Recommended Bundling Instruments
  • Leaptronix LA-2025 / LA-2050 / PLA-1016 / PLA-2532
 

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