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SiC Substrate/EPI Wafer Size: 2” 4” 6” 8”
Wafer Thickness: 300 μm - 550 μm
Chuck: XY Stage Repeatability : 0.1 μm
Inspection Items: Whole Wafer Defect Scan (MicroPipe, BPD, TED, TSD, SF, etc.)
Whole Wafer Defect Scan
Estimated Inspection Time: 1 hr @4”wafer; 2 hrs @6”wafer; 4 hrs @8”wafer
Lateral Resolution: 1 μm
Analysis: MicroPipe Density (MPD); BPD/TED/TSD Density; Stacking Fault Area Percentage; Wafer Yield; Tri-angle and Carrot**
MicroArea 3D Scan (optional)
Field of View: 400 μm x 400 μm
Scanning Zoom: Yes ( 1x - 10x )
Scan Resolution: Up to 1024 x 1024
Lateral resolution: 0.4μm
Axial Resolution: 0.25μm
Min. Increment of Z stage: 0.02μm
Wide Field Module Camera: Color Camera (FOV 400 μm x 400 μm)
