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SiC/GaN Semiconductor Material Trends: From Materials Research to In-Depth Failure Analysis
2026年10月24日 09時59分14秒

As we enter the 2026–2030 period, wide-bandgap (WBG) semiconductor materials such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are transforming the power electronics, electric vehicle (EV/HEV), renewable energy, and AI data center industries. The shift from traditional silicon to SiC and GaN enables higher power density, smaller passive components, and improved overall system energy efficiency.

Chauvin Arnoux C.A 6117 Multifunction Electrical Installation Tester
2026年10月23日 15時26分05秒

An all-in-one testing solution that complies with the international standard IEC 60364-6. It features a 5.7-inch color graphical display, supports Type B RCD testing, includes memory for 1,000 measurements, and is equipped with a Lithium-ion battery providing 30 hours of continuous operation

Plastic Products with Color Streaks: How to Adjust Back Pressure and Screw Speed? How Should Color Be Measured to Verify Proper Adjustment?
2026年10月21日 15時30分17秒

In the middle of the night shift, a batch of light-gray plastic emerged, streaked with debris. The machine operator took one look and did what came most naturally: he cranked up the screw speed and increased the back pressure to ensure the orange-colored pellets melted completely. By morning, the color was indeed more uniform. A few weeks later, the customer returned the entire shipment the products had become brittle, cracking at the slightest impact, and the color varied from one delivery to the next, failing to match the approved standard

High-Speed Signal Validation and Chip Performance Optimization for AI Infrastructure
2026年10月19日 14時52分25秒

The increasing density of AI accelerators, high-bandwidth memory, and high-speed interconnects is placing more stringent demands on chip design. Beyond processing capability, chips must maintain signal integrity, operate reliably under heavy loads, and minimize power consumption. Combining high-speed signal measurements, electrical characterization, and power analysis helps engineers identify design limitations early, before hardware is deployed.

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