2026年11月09日 13時50分49秒
SiC and GaN semiconductor components feature high power density and compact dimensions, causing heat to be concentrated within a very small chip area. The question of which thermal management solution is most widely used is often framed as a choice between four options: fans, heatsinks, thermal pads, or thermal grease. This framing requires some refinement, as these four components occupy different positions along the same heat-transfer path; in fact, most designs employ a combination of several of these elements. This article explains the role of each component, how to select thermal interface materials, and the impact of temperature on measurements.
