Heraeus Electronics F712 Microbond solder

Microbond SMT712: Excellent wetting solder paste - Newest addition to the proven Microbond solder paste family

Heraeus Microbond SMT712 is designed to meet all the needs of demanding SMT applications. With a wide process window, and excellent high-speed printing and wetting properties, the ground-breaking innovation can be instrumental in keeping head-in-pillow defects to the minimum during the soldering process.

The FC712 flux system is specifically optimized for lead-free alloys, e.g. Sn/Ag/Cu. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue. As a result, it eliminates the need to clean flux residues.

Key benefits of Microbond^® SMT712:

• Stable viscosity for long stencil life

• Excellent wetting in air reflow

• Good fine pitch printing performance

• Wide process window

• Reduced BGA head-in-pillow defects

• Low voiding in solder joint (less than 3*3mm pad)

• Transparent residue in air reflow