ShuttleStar SV520 BGA リワークステーション

Manufacture: ShuttleStar
Model : SV520
Made in: China
Warranty : 12 months

Specifications:
PCB dimension:W20*D20~W400*450
PCB thickness:0.5~3mm
Working table adjustment: ±10mm Forward/backward, ±10mm Left/right
Temperature control: K-type Thermocouple,Close Close Cycle Controlled
Area heater: Far infrared: 2600W
Top heater: Hot Gas: 400W
Bottom heater: Hot Gas: 600W
PCB locationway: Outer or jig
Power supply: Single-phase 220v,50/60Hz
BGA dimension: 1*1~70*70mm
Min pitch of BGA ball: 0.15mm
Placement precision:  ±0.02mm
Max BGA weight: 300g
Machine dimension: L650*W800*H950
Weight: Appox 110kgs

Features：
The movable heating head is easy to operate; hot air head and mounting head are manually
controlled; PCB sliding rack is micro-adjustable with X and Y ases;
Color optical system with functions such as spilt vision, zoom-in and micro-adjust, autofocus
and menu operation, equipped with aberration detection device;
Color LCD monitor;
Touch screen interface, PLC control, with password and data protection function while power on;
 can display multipleprofiles at any time; temperature precisely controlled within 2℃.
Three heaters heating independently, both upper and lower heater can control multi stages
on the profile simultaneously, large bottom IR heating area to heat PCB evenly;temperature,
time, rate, cooling and alarm events are all displayed on the touch screen;
Over-heating protection for the hot air heating head; temperature of hot air in the upper and
infrared at the bottom is program controllable; 6segments of temperature up(down) and 6 segments
constant temperature control, profile saving is unlimited in the industrialcomputer; profile analysis can be
carried out on the touch screen; with computer communication function as computers, with communication software attached;
with temperature measurement function;
The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sin-kage in the soldering area;
 Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-adjustable.
Large IR pre-heating from the bottom, made of imported high quality heater, will heat the PCB evenly to avoid deformation
 and keep solder effect; heating board is independently controlled;