Tektronix Semiconductor Seminar 2026 – RegistrationTektronix Semiconductor Seminar 2026 – RegistrationThe global semiconductor industry is entering an increasingly competitive era, driven by the rapid growth of artificial intelligence (AI), autonomous vehicles, and high-performance computing. To remain competitive and gradually strengthen its position in the global value chain, Vietnam faces a key strategic question: Where should the country start to optimize its resources and close the gap with regional leaders?
A Strategic Starting Point: IC Design, Assembly, Testing & Packaging (ATP)
Rather than immediately investing in semiconductor fabrication plants (fabs), which require tens of billions of US dollars and involve extremely high technological barriers, the most viable pathway for Vietnam is to focus on two strategic areas:
Integrated Circuit (IC) Design: Leveraging its young workforce with strong foundations in mathematics and information technology (IT), Vietnam can participate in the design of integrated circuits, power management integrated circuits (PMICs), automotive interface chips, and microcontrollers for the Internet of Things (IoT).
Assembly, Testing & Packaging (ATP): Attracting global semiconductor corporations while strengthening capabilities in physical-layer validation and IC characterization to ensure compliance with stringent quality standards before products are shipped.
Key Technical Issues and Challenges in Joining the Semiconductor Value Chain
Despite its considerable potential, Vietnam’s businesses and R&D centers face significant challenges in establishing the advanced test and measurement infrastructure required by the semiconductor industry:
High-Speed Signal Validation and Next-Generation Semiconductor Materials: The emergence of wide-bandgap semiconductors, such as gallium nitride (GaN) and silicon carbide (SiC), requires highly accurate loss analysis, including switching-loss measurements with nanosecond-level precision.
Challenges Posed by Next-Generation Communication Protocols: Automotive processors and AI infrastructure must comply with automotive Ethernet standards (100BASE-T1/1000BASE-T1) and Time-Sensitive Networking (TSN). Separating full-duplex signals over twisted-pair cables and measuring PTP PPS phase offsets require sophisticated, often expensive, analysis tools.
Limited Access to Standardized Laboratory Infrastructure: Many research laboratories and businesses lack access to automated test and measurement systems, resulting in longer product development cycles and delayed commercialization.
Benefits of Automated Testing and Measurement Solutions Aligned with International Standards
To address these validation challenges, investing in advanced test and measurement solutions can provide a direct competitive advantage:
Automated Compliance Testing: Standardizing physical-layer testing procedures in accordance with IEEE and OPEN Alliance SIG specifications enables automatic Pass/Fail reporting and reduces validation time from several days to just a few hours.
Software-Based Signal Decoding: Analyzing bidirectional PAM3 eye diagrams without bulky hardware decoders helps avoid signal distortion and simplifies the measurement setup.
Standardized Laboratory Infrastructure for R&D and Education: Equipping laboratories with advanced test and measurement solutions enables Vietnamese engineers to master next-generation oscilloscopes and narrow the technical skills gap with international experts.
Discover Advanced Test and Measurement Solutions at Tektronix Semiconductor Seminar 2026
To support Vietnamese businesses and the engineering community in adopting the latest semiconductor test and measurement standards, EMIN Vietnam, in collaboration with Tektronix, is organizing an in-depth technical seminar:
“Tektronix Semiconductor Seminar 2026”
Time: 9:00 AM – 2:00 PM, Wednesday, November 11, 2026
Venue: 6th Floor, National Innovation Center (NIC), Lane 7 Ton That Thuyet Street, Cau Giay District, Hanoi, Vietnam
Key Topics
High-speed signal validation solutions for AI infrastructure and next-generation integrated circuits.
Wide-bandgap semiconductor characterization (SiC/GaN) and failure analysis.
Hands-on demonstrations and real-world simulations using Tektronix MSO Series 4B, 5B, and 6B high-performance oscilloscopes, together with software solutions for decoding automotive Ethernet and TSN protocols.
IC design engineers, R&D specialists, and business leaders interested in these topics are invited to register for free at:
