ADLINK Technology DB30 x86 디버거 보드 4세대 BMC 탑재 COM Express용 다목적 디버그 보드

Dimensions: 81.6 mm x 66.8 mm x 1.6 mm

Interface Type: IDC

Description/Function: Multi Purpose Debug Board for 4th BMC Eequipped COM Express

Tool Is For Evaluation Of: COM Express Modules

Maximum Operating Temperature: + 60 C

Minimum Operating Temperature: 0 C