Alliance Memory AS4C16M16MSA-6BIN DRAM 칩 모바일 LP SDRAM 256M-비트 16M X 16 1.8V 54-핀 FBGA

Type: Mobile LP SDRAM

Density: 256 MB

Package: 54FBGA

Mounting: Surface Mount

DRAM Type: Mobile LP SDRAM

Pin Count: 54

Lead Finish: Tin-Silver-Copper

No. of Pins: 54

Organization: 16M x 16

Sub-Category: Mobile LP SDRAM

Data Bus Width: 16 Bit

Memory Density: 256 Mbit

Number of Banks: 4

Screening Level: Industrial

Supplier Package: FBGA

Address Bus Width: 13 Bit

Maximum Clock Rate: 166 MHz

Product Dimensions: 8 x 8 x 0.7(Max) mm

Supply Voltage Nom: 1.8 V

Clock Frequency Max: 166 MHz

Number of I/O Lines: 16 Bit

Operating Temperature: -40 to 85 °C

Number of Bits per Word: 16 Bit

Operating Supply Voltage: 1.8, 2.5, 3.3 V

Maximum Operating Current: 80 mA

Operating Temperature Max: 85 °C

Operating Temperature Min: -40 °C

Maximum Random Access Time: 5.5/6/22 ns

Datasheet