Aries Electronics 24-650000-10 SOIC 및 SOJ-투-DIP 어댑터 24P SOIC/DIP 소켓

Pitch: 2.54 mm

Features: SOIC and SOJ-to-DIP adapter

Case Style: DIP

Row Spacing: 15.24 mm

Unit Weight: 15.403 g

Mounting Style: Through Hole

Number of Rows: 2 Row

Contact Plating: Tin

Contact Material: Brass Alloy

Termination Style: Solder Pin

Number of Positions: 24 Position

Maximum Operating Temperature: + 105 C

Minimum Operating Temperature: - 55 C