Bergquist 2478430 서멀 패드 GAP PAD, S-클래스, GAP PAD TGP5000/5000S35

Color: Light Green

Material: Silicone Polymer

Unit Weight: 5.160 g

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C