FISCHER FISCHERSCOPE X-RAY XDV-μ LD 코팅 두께 측정기 (Ø 60 µm halofree*)

Microfocus tube with tungsten anode; molybdenum anode optionally available

Flexible, 4-fold exchangeable primary filter

Polycapillary optics for particularly small measuring spots (10 – 60 µm FWHM) with short measuring times

Silicon drift detector

Video system with 3× optical zoom for precise sample positioning

Precise, programmable measuring stage for automated measurements

Applications

Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range

Assembled and unassembled circuit boards

Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range

Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd

Lead-free solder caps on copper pillars

Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry

Brochure