FISCHER FISCHERSCOPE X-RAY XDV-μ LEAD FRAME 코팅 두께 측정기 (Ø 50 µm halofree*)

Helium flush allows for measurement of even very light elements starting at sodium

Polycapillary optics

High-power tubes with chrome anode

4-fold automatically exchangeable filter

High-resolution CCD color camera, crosshairs with calibrated scale, adjustable LED illumination and laser pointer (class 1) for exact sample placement

Silicon drift detector

Fast, programmable XY-stage with pop-out function and electrically driven Z-axis for automated measurements

Applications

Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range

Assembled and unassembled circuit boards

Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range

Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd

Lead-free solder caps on copper pillars

Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry

Brochure