FISCHER FISCHERSCOPE X-RAY XDV-µ PCB 코팅 두께 측정기 (Ø 20 µm halofree*)

Universal instrument for automated measurements on smallest structures, multilayers, functional coatings and very thin coatings < 0.1 µm

Microfocus tube with tungsten anode; molybdenum anode optional

Measuring direction with measuring top down

4-fold changeable filters

Polycapillary optics permit particularly small measuring spots Ø approx. 20 or 10 µm

Silicon drift detector 20 or 50 mm² for highest precision on thin layers

Programmable measuring table for printed circuit boards up to 613 × 610 mm, optionally with vacuum function

Applications

Au/Pd/Ni/CuFe and Sn/Ni coatings in the micro- and nanometer range

Assembled and unassembled circuit boards

Testing of base metallization layers (under-bump metallization, UBM) in the nanometer range

Measurement of light elements, e.g. determination of the phosphorus content (in ENEIG/ENEPIG) under Au and Pd

Lead-free solder caps on copper pillars

Testing the elemental composition of C4 and smaller solder bumps, as well as small contact surfaces in the semiconductor industry

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