FISCHER FISCHERSCOPE X-RAY XDV-MUE SEMI 코팅 두께 측정기

Fully automated wafer handling and testing boost efficiency

XRF system with excellent detector sensitivity and high resolution

XRF system with polycapillary optics from the worldwide technology leader for measuring micro-spots 

Accurately tests structures up to 10 µm in diameter

Automatic pattern recognition pinpoints the positions to be measured

Multiple operating modes; manual measurement possible whenever required

Flexible: docking station for FOUP, SMIF and cassette, for 6", 8" and 12" wafers

Applications

- Coating Thickness Measurement:

Base metallization layers (UBM) at the nanometer scale

Thin lead-free solder caps on copper pillars

Extremely small contact surfaces and other complex 2.5D / 3D packaging applications

- Material Analysis:

C4 and smaller solder bumps

Lead-free solder caps on copper pillars

Brochure