Litepoint IQxstream-M Multi-DUT Mobile & IoT Test System

Datasheet

IQxstream-M™, multi-DUT manufacturing test solution capable of calibration and verification of 2G/3G/4G devices and IoT modules operating on NB-IoT, Wi-Fi, Bluetooth, Zigbee.

Its ultra-compact design and flexible architecture makes it highly suitable for high volume manufacturing of smartphones, tablets and cellular IoT modules.

Simple Setup with Higher Production Throughput

Simplifies manufacturing test of complex smartphone technologies

Provides 32 RF ports for parallel testing with direct connections to the DUT antenna, reducing the complexity of the test setup by eliminating external components

Delivers industry-leading high manufacturing yield with its best-in-class VSA power accuracy

Ideally Suited for Mobile & IoT requirements

No external components required for test setup

Easy application setup expedites test solution deployment

Versatile test solution, with comprehensive coverage of all mobile device wireless cellular and connectivity technologies

Optimized for high-end and high-volume mobile device manufacturing

Maximizes up-time with Factory Efficiency features, which detect and diagnose potential fixture issues

Hardware options for single device, multi-device and MIMO testing allow for system configuration customization

Comprehensive LTE NB-IoT Chipset Support

IQxstream-M is designed into all of the leading IoT chipset company software tools, providing simple bring-up and deployment of LTE IoT devices

Cellular, IoT and Connectivity Technology Options

GSM / EDGE

CDMA / CDMA2000

W-CDMA HSPA / HSPA+

TD-SDCMA

LTE TDD / FDD

LTE-Advanced

LTE IoT UE categories Cat 1, Cat 0 (Cat M1) and Cat NB1 (NB-IoT)

Wi-Fi, 802.11a/b/g/j/n/p

Wi-Fi, 802.11af/ah

Bluetooth, Classic (1.x, 2.x, 3.0), Low Energy (4.0, 4.1, 4.2) and Bluetooth 5

Zigbee, Z-Wave and Wi-SUN

DECT

LTE

LPWAN, Sigfox / LoRa

Navigation (carrier-to-noise): GPS, GLONASS, Compass

When & Where to Use the IQxstream-M for Testing?

In manufacturing environments

For products in the PCB-level manufacturing, RF modules or end-of-line manufacturing lifecycle stages

For mobile or IoT devices