Mechatronika MR10 Reflow Oven (200 × 300 mm)

PCB: Size 200 × 300 mm, soldering area 170 × 270 mm

Soldering Cycle: Automatic, typically 4 min

Programming: 12 non-volatile soldering profiles

Dimensions & Weight: 900 × 520 × 350 mm, 30 kg

Power Supply: 230 V, 50 Hz, 2 kW

Power Consumption (Average): 1.5 kW

Fully programmable far IR oven

Thermally optimised process

Auto profiling equipment for exact soldering with minimal test expenditure

Single phase 230 V supply

Special heater layout for homogenous heat distribution

Good price to performance ratio