PACEWORLDWIDE TF2800 BGA 및 SMD 재 작업 시스템 (Max.PCB Size 610x610mm; 1900W)

Option: Choose suitable nozzles that are compatible with components when purchasing.

Power requirement: 230 VAC, 50 Hz (2400 Watts maximum)

Dimensions: 737mm (29”) H x 1118mm (44”) W x 965mm (38”) D

Weight (Without Computer): 90kg (200lbs)

Top-side Heater: Patented Inductive-Convection Heater, 300 Watts

Bottom-side Preheater with Adjustable Working Height: Medium/Long wave IR, 1900 Watts with array of 7 IR emitters capable of preheating large, high mass assemblies; Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB

Active Cooling Capability: Standard, offers swift, yet controlled component/PCB cooling, directly through the nozzle

High Sensitivity Vacuum Pick: Pick is counterweight balanced, and utilizes an optical sensor and precision high temperature linear ball bearings, ensuring delicate placement and pick up of parts from PCB. Includes seven (7) Vacuum Picks

Precision Placement Capability: Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement

Placement Accuracy: Stepper motor with precision positioning of to 28μm (.0011") accuracy

Temperature Setting Range:

- Top Heater: 100˚ to 400˚ C (212˚ - 750˚ F);

- Bottom Heater: 100˚ to 221˚ C (212˚ - 430˚ F)

Maximum/Minimum PCB Size: Maximum: 610mm x 610mm (24” x 24”); Minimum: N/A arms close down completely

Maximum/Minimum Component Size: Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.

Thermocouple Inputs: Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)

MANUAL

DATASHEET

BROCHURE TF SERIES

VIDEO 1

VIDEO 2