Samtec TFM-110-01-H-D-RE1-WT 와이어 투 보드 커넥터

Pitch: 1.2700 mm

Gender: Header

Mounting: Through Hole

Lead Finish: Gold

Housing Color: Black

Product Depth: 8 mm

Product Height: 6.48 mm

Product Length: 19.38 mm

Contact Plating: Gold

Body Orientation: Right Angle

Contact Material: Phosphor Bronze

Product Dimensions: 19.38 x 8 x 6.48 mm

Termination Method: Solder

Max Processing Temp: 260

Base/Housing Material: LCP (Liquid Crystal Polymer)

Operating Temperature: -55 to 125 °C

Datasheet