Samtec TFM-115-01-S-D-RA 핀 헤더, 보드-투-보드, 와이어-투-보드, 1.27 mm, 2열, 30핀, 관통 홀 라이트 앵글

Type: Shrouded

Pitch: 1.27 mm

Gender: Header

Mounting: Through Hole

Lead Finish: Matte Tin Over Nickel

Series Name: TFM

Housing Color: Black

Product Depth: 7.37 mm

Number of Rows: 2

Product Height: 5.72 mm

Product Length: 22.23 mm

Contact Plating: Gold Over Nickel

Body Orientation: Right Angle

Contact Material: Phosphor Bronze

Number of Contacts: 30

Product Dimensions: 22.23 x 7.37 x 5.72 mm

Termination Method: Solder

Max Processing Temp: 260

Base/Housing Material: LCP (Liquid Crystal Polymer)

Operating Temperature: -55 to 125 to 125 °C

Maximum Current Rating/Contact: 3.7 A

Datasheet