For full functionality of this site it is necessary to enable JavaScript.
EMIN.VN
0

Secret to remove voids in castings, comparison of hot pressing and cold pressing

2025년 11월 14일 09시 04분 38초

For sample preparation, the ultimate goal is to obtain a perfect casting, that is, one that does not have any voids or gaps sticking to the surface of the sample. The presence of air bubbles, no matter how small, will seriously distort the results when we analyze the microstructure, measure hardness, or check for material defects. That is why the choice of casting method is a key technical decision that cannot be taken lightly.

The role of the press in sample analysis standards

The sample press is an important intermediate step that helps fix the material sample in a hard plastic mold, creating a sample with standard size, flat surface and easy to manipulate in the next steps. Thanks to the sample pressing process, small, thin or complex-shaped samples are firmly reinforced, avoiding deformation when grinding, polishing and ensuring that the area to be observed is always in the correct position. 

During the entire process of preparing metal samples, mounting machines helps standardize the size, increase stability when clamping, keep the analysis surface clean, and reduce errors due to manual operations.

To eliminate this error, we usually have only two main methods: Hot Press and Cold Press. Each method has its own mechanism to handle air bubbles, and understanding this is the key to mastering sample quality.

Hot Pressing, Pressure Mechanism and Fluidization of Plastic

The Hot Mounting method uses a specialized device that combines two powerful physical factors: high temperature and high pressure. This is a forced process, aiming to create a molded sample with almost absolute tightness.

Forced Compression: When the molding machine operates, high pressure (usually 200 bar or more) will compress the entire molten plastic block. This pressure will force the trapped air bubbles inside to shrink or melt out of the plastic block, no longer able to exist as a significant sized void.

Viscosity Reduction: High temperatures cause the molding resin (usually a thermosetting resin) to become extremely fluid. This fluidity allows the resin to flexibly flow into and fill any microscopic cavities, gaps, or cracks in the surface of the specimen that the resin cannot do under normal conditions.

It is the combination of the high fluidity of the material and the powerful pressure applied by the machine that makes hot pressing the first choice for samples that require absolute tightness and high uniformity. However, it is important to note that if your sample is sensitive to heat (e.g. some alloys have fusible phases), hot pressing can change the surface microstructure.

Refer to some products in Category: EMIN distributed sample presses

The secret to Cold Pressing is vacuum sealing

Cold pressing is a must for materials that cannot withstand high temperatures and pressures, such as electronic materials, polymers, or some special alloys. In this method, the resin is cured (usually Epoxy or Acrylic) by a chemical reaction.

Origin of Air Bubbles: The main problem with cold pressing is not the curing process itself, but the mixing of the resin with the curing agent. Manual mixing always creates a large amount of air bubbles that are trapped within the mixture.

Vacuum Solution: Instead of applying pressure, we use the opposite mechanism: reducing the pressure. Immediately after the resin mixture is poured into the mold, we place the whole thing in a vacuum chamber. The sudden reduction in pressure will cause all the air bubbles that are trapped inside the mixture to swell and be sucked out before the resin begins to cure.

If the vacuum step is omitted, cold pressing will almost certainly result in voids, especially in the crevices and corners of the specimen. Using a dedicated vacuum machine has transformed cold pressing from an error-prone manual method into an effective quality control process, ensuring that the material structure is preserved while achieving the desired density.

관련 뉴스

INVITATION: KEYSIGHT BOOTH AT INTELLIGENT ASIA HANOI 2026
2026년 06월 26일 11시 50분 23초

Intelligent Asia Hanoi 2026 will take place at the National Exhibition Center (VEC) in Dong Anh from July 1 to 4, 2026. Although a newcomer to the specialized exhibition circuit, the event has already established its standing by bringing together hundreds of leading enterprises from the electronics and smart manufacturing sectors. It serves as a vital bridge, enabling manufacturers to meet, negotiate, and access the latest technological solutions

Realizing a High-Performance RF System: The Combination of MATLAB and Tabor Proteus
2026년 06월 26일 10시 32분 59초

Bridging the gap between theoretical simulation and actual hardware implementation remains the greatest challenge in advanced engineering projects. In fields such as radar, 5G/6G, and quantum computing, a lack of synchronization between the design environment and operational hardware often prolongs development timelines

Downtime Doesn't Strike Suddenly: Many Factories Lose Hundreds of Hours of Production by Overlooking Subtle Warning Signs
2026년 06월 25일 14시 15분 17초

For many factories, downtime is often viewed as an unexpected event that strikes during a production shift. In reality, however, the situation is different. Before a motor fails, a variable frequency drive (VFD) reports an error, or a production line requires an emergency stop, the equipment typically emits multiple warning signals—such as abnormal temperature rises, excessive vibration, degraded power quality, or unstable communication performance. These indicators can persist for days or even months before an actual breakdown occurs

Micsig MOIP Series: Comprehensive testing solution for high-power three-phase inverters
2026년 06월 22일 11시 36분 21초

The widespread adoption of wideband semiconductor components such as SiC and GaN in photovoltaic inverters, motor drives, and automotive charging systems has driven the switching frequency and power density of three-phase inverters to unprecedented levels. However, this development has also brought with it severe measurement challenges: high voltages, intense electromagnetic interference, and the requirement for ultra-fast switching signal capture at the nanosecond scale

혜택 소식 받아보기

대량 할인, 도매 가격 업데이트 및 신제품 소식을 이메일로 받아보세요.

구독하면 당사의 서비스 이용약관개인정보 처리방침에 동의하는 것으로 간주됩니다.

빠른 지원

인증된 전문가에게 직접 연결