빠른 지원
인증된 전문가에게 직접 연결
인증된 전문가에게 직접 연결
Specifications：
PCB dimension: W50*D50~W450*D400mm
Features：
Made of high quality heating material, desoldering and
soldering procedures of BGA are precisely controlled;
Air flow and temperature are adjustable in a wide range
to produce high temperature breeze;
Movable heating head, which can be moved horizontally;
easy to operated;
The temperatures of the upper and lower hot air guns can be
precisely controlled according to their specific
temperatures. The infrared constant temperature heating zone
at the lower part and the appropriate temperature-
control settings make the rework safer and more reliable;
Touch screen interface, PLC control, real-time temperature curve display,
be able to display temperature curves
and detecting curves at the same time;
Powerful cross flow fans cool the lower heating area rapidly;
6 segments of temperature up (down) and 6 segments constant
temperature control, 200 groups of temperature
curves are stored, Curve analysis can be carried out on the touch screen;
The supports for the BGA soldering supporting frame are
micro-adjustable to restrain local sinkage;
The adjustable PCB positioning support, onto which the special
fixtures for allotype board could be installed,
enables easy and fast positioning of the PCB board;
Buzz after soldering is finished or desoldering, Hand vacuum pen
is adjustable for removing BGA;
Both the upper and lower parts are equipped with over-temperature
alarming and protection apparatus;
With different alloy hot gas nozzles, easy to replace,
It could be tailored as per the specific requirements;
The integrated design of machine and chassis is room-saving,
could be altered to instrument-control.
