Shuttlestar SV-650A BGA Rework Station

- PCB & Component Requirements

Max.PCB size: 540mm x450mm 

Max.PCB thickness: 0.5~4mm 

Max.BGA size: 80mm x 80mm 

Min.BGA size: 4mm x 4mm 

Max. BGA weight: 80g

- Vision System Specifications

Max. visible area: 40mm x 40mm 

Min. Pitch: /0.15mm 

Micrometer Adjust Range: Front/Rear ± 5mm  Left/Right ± 5mm 

Rotation Angle: 360°

- Thermal Specifications

Max.temp.for hot-air heater: 350° C 

Max.temp.for IR heater: 400° C 

Temperature control: 8-Stage Programmable Temperature Settings 

Upper heater power: 1200W 

Lower heater power: 800W 

Bottom IR heater power: 3600W

- Dimensions & Power Requirements:

Machine dimension: 746mm (L) 710mm (W) 820mm (H)

Weight: Appox 90Kg 

Power Requirements: Single Phase, 220VAC, 50/60 Hz, 

Datasheet