Suneast CBD2200 EVO IC Bonder

Placement accuracy:        ≤+10um@3σ

Placement  angle  accuracy:        ±0.15°@3σ

Force control range:        20~1000g (with different configurations,the maximum support is 7500g)

Force control accuracy:        20g-150g:±2g;  150g-1000g:±5%

Substrate pallet size(mm):        L200XW90~150

Tray size(mm):        Based on customer products

Loading/Unloading:        Manual /auto

IC dimension(mm):        L0.25*W0.25-L10*W10

IC supply:        Waffle tray

Core module movement mode:        Linear motor+grating scale

Glue feeding mode:         Dispensing+painting glue

Auto change nozzle:        Seven

Bottom photo-taking:        Equipped with camera

Machine  dimension(mm):        L(1400)*W(1250)*H(1700)

Weight:        Net weight of equipment:Approx.1500Kg

*Remarks: Customization  is  supported