Placement accuracy: ±10um@3σ
Placement angle accuracy: ±0.3°@3σ
Loading mode: Wafer box
Die size(mm): 0.25*0.25mm-10*10mm
PCB size(mm): L300*W100
Placement head: 0-360°rotation/Auto change nozzle(option)
Placement pressure(N): 30-500g
Glue feeding mode: Support: dispensing, dipping, painting
Core motion module: Linear motor + grating scale
Platform base of machine: Marble platform
Machine dimension(L×W×H): 1610mm×1380mm×1620mm
*Remarks: Customization is supported
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