Universal Instruments Flexbond Hot Bar Bonding Platform

Manufacturer: Universal Instruments - USA

Model: Flexbond

Warranty: 12 months

The Flexbond™ high-throughput hot bar bonding platform enables the first fully automated volume solution for advanced flex circuit and other hot bar interconnect applications. It combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux transfer, high-accuracy placement and hot bar soldering.

These configurable solutions have been shown to provide 6X to 12X the throughput of traditional semi-automated assembly stations and more than twice that of alternative automated hot bar solutions while reducing floor space requirements by 80%. They also require significantly fewer machines and offer the lowest OPEX and $/cph/m2.

• The first high-throughput automated hot bar bonding platform

• Industry-best performance and a maximum bonding rate of 1800 UPH

• Dual-zone parallel processing with up to 6 heads per zone, 12 heads total (4X alternative solutions)

• Programmable, closed-loop temperature control ensures alignment with solder profiles

• Under-board constant heat balances thermal load for flex-to-flex applications

• Programmable pressure settings and high-accuracy management provide superior bonding control

• Conveyor-style architecture with adjustable width adapts to range of applications

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