Trạm hàn BGA PACE IR 3000 (không cần dùng đầu típ)

Gia nhiệt (từ trên xuống): trung bình/dài  hồng  ngoại IR, 500W
Nhiệt từ dưới lên có điều chỉnh: chiều cao làm việc trung bình/dài hồng ngoại, 1000W 220 x 155mm (8.6" x 8.6")
Kích thước linh kiện max: 65 x 65mm (2.5" x 2.5")
Kích thước tấm mạch Max PCB: 305 x 305mm (12" x 12")
Độ phân giả quang học: 0.52mm (0.02") mỗi vòng
Độ chính xác vị trí: (trục Z)± 25 µm (0.001")
Chân không: 450mm Hg
Nguồn: 230 VAC, 50 Hz (2000 w max)
Hệ thống quan học: độ phân giải cao, hệ thống nhìn quan sát lớp trên với camera màu
Video vào: 2 Composite (B/C) và1 "S" Video (For alignment optics)
Cài đặt giải nhiệt độ:
  lớp trên 100°đến 400°C (212° đến 750°F)
  lớp dưới: 100°đến 221°C (212°đến 430°F)

Chi tiết

Manuals

 Cataloge

 

IR 3000 Infrared BGA Rework System

IR3000 BGA Rework Station

Production BGA Installation & Rework WITHOUT the Expensive Nozzles!

IR3000 BGA Rework StationThe IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3000 does not require heat-focusing nozzles, saving you thousands in additional costs. Instead, it uses a unique aperture system to control and precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR thermal sensor, the process is completely closed loop temperature controlled using non-contact measuring methods. Sodr-Cam Reflow Process Observation Camera allows you to watch the entire reflow process happen in real time.

Operator-Friendly Software ... Thermal Profiling Made Easy

IR3000 Profile Development Software is Truly Operator-Friendly

The IR 3000  fully integrated software and step-by-step instructions makes profiling incredibly simple for even the most advanced BGA and CSP applications. The software is unique in that it uses PACE-exclusive, custom developed, PID controllers to control user determined ramp rates by selecting the time and the end temperature for each phase and provides intuitive set-up, multi-stage profiling, On-the-Fly profile adjustment, flux-dipping, and much more.

PACE Exclusive Height Adjustable Bottom-Side Preheater

IR3000 Height Adjustable Bottom-Side Preheater

The bottom preheater features an incredibly efficient, high power, quick response quartz IR emitter that is adjustable when more power is required for high thermal mass applications. The preheater can be adjusted from its standard position up to 38mm (1.5") closer to the PCB for those applications where additional heat is desired or needed! This is a unique PACE feature designed especially for use with Lead-Free processes and your highest-mass, heat-sinking PCB!

Advanced Features

Exploded view of IR3000 Advanced Features

IR3000 Non-Touch Infrared Thermal Sensor
Non-Contact IR Thermal Sensor
For added verification, a closed-loop, non-contact IR Temperature Sensor monitors and controls the ramp-up and temperature of the component in real time, by controlling the top heater output throughout the heating process.

 

 

 

IR3000 Sodr Cam Reflow Process CameraSodr-Cam Reflow Process Observation Camera
With its high-resolution, zoom and lighting features, Sodr-Cam allows the operator to view the entire reflow process, including the exact moment of solder melt! Sodr-Cam is on a movable extension arm that provides great flexibility.

 

 

 

IR3000 Vision Overlay System for Optical Alignment of BGA, CSP, QFN, LCCVision Overlay System (VOS) for Precision Optical Alignment
The Vision Overlay System uses a beam splitting prism for simultaneous view of PCB pads and component balls, and features a high resolution, color digital camera with PC controlled 72x zoom, focus, auto-focus, and lighting control.

 

 

 

IR3000 Active Cooling Fan
Active Cooling Fan
During the Cool-Down Phase of a profile, the Active Cooling Fan automatically delivers controlled, active cooling of component and PCB, lessening the risk of excessive intermetallic growth and yielding high quality solder joints.

 

 

 

IR3000 Flux Dipping Tray Automated Flux Dipping Tray
If flux dipping is needed, the part can be automatically dipped in gel or paste flux. Flux dipping adds a precise amount of flux to balls of a BGA, preventing the excessive solder voiding that occurs when too much flux is applied.

 

 

 

IR 3000 Precision PCB HolderPrecision PCB Holder
Features precision micrometer X & Y adjustments for the most delicate alignment (Theta control is on Reflow Head). Board holder arms with movable clamps provide support for the most irregularly shaped boards with unusual edges.

 

 

 

IR3000 Component Centering NestAdjustable Component Centering Nest
A removable and adjustable Component Nest is provided for perfect centering of components, in preparation for vacuum pick-up/placement.  The part is lifted to the proper height above the optics, ready to be aligned to the PCB.

 

 

 

The IR3000 comes with 6 different sized vacuum picks
Vacuum Picks
The system comes with 6 different size vacuum picks to handle a wide range of components as well as a selection of O-rings for irregularly surfaced components. An optional 20 gauge Micro Vacuum Pick is also available.

 

 

 

 

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