ADLINK Technology I-COM-HPC-sIDH-2796-X557 Dev Kit ADLINK科技COM-HPC Intel Ice Lake-D HCC开发套件，配备D-2796 CPU模块，带载板，X557 OCP，散热器及配件

Name: ADLINK Technology I-COM-HPC-sIDH-2796-X557 Dev Kit ADLINK科技COM-HPC Intel Ice Lake-D HCC开发套件，配备D-2796 CPU模块，带载板，X557 OCP，散热器及配件
Brand: ADLINK Technology