Bergquist 2198164 导热垫 GAP PAD，S级，2.1x4英寸，TGP5000/5000S35

Size: 2.1 in x 4 in

Color: Light Green

Width: 53.34 mm

Length: 101.6 mm

Material: Silicone Polymer

Unit Weight: 9.790 g

Designed for: VRMs, POLs, CDROM/DV ROM, PCB to Chassis, ASICs/DSPs, Memory Packages/Modules, Thermally Enhanced BGA's

Breakdown Voltage: 5 kVAC

Flammability Rating: UL 94 V-0

Thermal Conductivity: 5 W/m-K

Maximum Operating Temperature: + 200 C

Minimum Operating Temperature: - 60 C