Fujikura 68S+ 光纤熔接机

Compatible Fiber Type: Single / SMF(G.652/657), MMF(G.651), DSF(G.653), NZDSF(G.655)

Cleaved Length: 5mm to 16mm with coating clamp

Cladding/ Sheath Diameter: 80~150μm / 100~3000μm

Splicing Mode: Max 100  modes

Heating Mode: Max 30 modes

Return Loss: >>60dB

Tension Test: 1.96 to 2.25N

Typical Splice Loss: 0.02dB (SM), 0.01dB(MM), 0.04dB(DS) and 0.04dB(NZDS) Measured by cut-back method relevant to ITU-T and IEC

Typical Splicing Time: 7-9 sec. SM FAST

Typical Heating Time: 23sec FP-03, coating dia.250μm ;25sec FP-03, coating dia.900μm; 15sec Slim 60mm/ Slim 40mm coating dia.250um

Results Storage: last 15,000 splices

Wireless Connectivity: Wireless technical standard: Bluetooth®4.1*1 OS: Android 5.0 or above, iOS 8.0 or above (iPhone 6 above)

Electrode Life: 5000 splices

Splice / Heating Circle: Typical 300 cycles with BTR-09

Applicable protection sleeve: Max. 66mm

Fiber View & Magnification: 2 axis 2CMOS camera with 5 inch colour LCD. 320X magnification. 400X magnification after splicing.

Upgrading: PC software upgrade / data management

Resistance features: Shock resistance: 76cm (30inch) 5 difference surface drop*2

                                  Dust resistance: Exposure to dust (0.1 to 500μm dia. Alumina Silicate)*2

                                  Rain resistance: H=10mm/hr for 10min*2

Operating condition: Altitude: 0 to 5,000m above sea level; Wind: 15m/sec ;Temperature: -10 to 50°C;Humidity: 0 to 95%RH, non-dew

Size: 170W×173D×150mm (excluding rubber bumper)