GSI Technology GS882Z36CGD-300 SRAM存储器

Density: 9 Mbit

Package: 165FBGA

Mounting: Surface Mount

Rad Hard: No

MSL Level: MSL 3 - 168 hours

Pin Count: 165

Lead Finish: Tin-Silver-Copper

No. of Pins: 165

Timing Type: Synchronous

Architecture: Flow-Through|Pipelined

Memory Density: 9 Mbit

Number of Ports: 4

Number of Words: 256 kWords

Screening Level: Commercial

Supplier Package: FBGA

Address Bus Width: 18 Bit

Product Dimensions: 15 x 13 x 0.94 mm

Supply Voltage Max: 3.6, 3.6 V

Supply Voltage Min: 3, 3 V

Supply Voltage Nom: 3.3, 3.3 V

Clock Frequency Max: 300 MHz

Max Processing Temp: 260

Number of I/O Lines: 36 Bit

Operating Temperature: 0 to 70 °C

Data Rate Architecture: SDR

Number of Bits per Word: 36 Bit

Maximum Operating Current: 165@Flow-Through|225@Pipelined mA

Operating Temperature Max: 70 °C

Operating Temperature Min: 0 °C

Maximum Random Access Time: 5@Flow-Through|2.5@Pipelined ns

Maximum Operating Supply Voltage: 2.7, 3.6 V

Minimum Operating Supply Voltage: 2.3, 3 V

Typical Operating Supply Voltage: 2.5, 3.3 V

Datasheet