Microbond SMT712: Excellent wetting solder paste - Newest addition to the proven Microbond solder paste family
Heraeus Microbond SMT712 is designed to meet all the needs of demanding SMT applications. With a wide process window, and excellent high-speed printing and wetting properties, the ground-breaking innovation can be instrumental in keeping head-in-pillow defects to the minimum during the soldering process.
The FC712 flux system is specifically optimized for lead-free alloys, e.g. Sn/Ag/Cu. This formula provides superior performance on a variety of surfaces finishes and leaves behind a clear residue. As a result, it eliminates the need to clean flux residues.
Key
benefits of Microbond® SMT712:
Stable viscosity for long stencil life
Excellent wetting in air reflow
Good fine pitch printing performance
Wide process window
Reduced BGA head-in-pillow defects
Low voiding in solder joint (less than 3*3mm pad)
Transparent residue in air reflow
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