Infineon S29GL256S10DHIV13 闪存

Density: 256 Mbit

Package: 64FBGA

Mounting: Surface Mount

Rad Hard: No

Cell Type: NOR

MSL Level: MSL 3 - 168 hours

Pin Count: 64

Boot Block: Yes

Interfaces: Parallel

Access Time: 100 ns

ECC Support: No

Lead Finish: Tin-Silver-Copper

No. of Pins: 64

Architecture: Sectored

Interface Type: Parallel

Memory Density: 256 Mbit

OE Access Time: 25 ns

Number of Words: 16 MWords

Program Current: 100 mA

Screening Level: Industrial

Supplier Package: FBGA

Address Bus Width: 24 Bit

Page Read Current: 25 mA

Block Organization: Symmetrical

Maximum Erase Time: 1.1/Sector s

Product Dimensions: 9 x 9 x 1(Max)

Supply Voltage Nom: 3 V

Max Processing Temp: 260

Programming Voltage: 2.7 to 3.6 V

Operating Temperature: -40 to 85 °C

Location Of Boot Block: Bottom|Top

Number of Bits per Word: 16 Bit

Maximum Page Access Time: 25 ns

Maximum Programming Time: 269/Sector ms

Maximum Operating Current: 60 mA

Operating Temperature Max: 85 °C

Operating Temperature Min: -40 °C

Maximum Random Access Time: 100 ns

Simultaneous Read/Write Support: No

Typical Operating Supply Voltage: 3.0000 V

Erase Suspend/Resume Modes Support: Yes

Datasheet