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PCB Thickness: 0.8 mm to 3.0 mm
Maximum Depaneling Length: 445mm (17.5") (Option 483mm (19"))
V-Scoring Lines:
Depth of scoring (A): ≥ 0.25 mm
Remaining PCB thickness (B): 1.0 mm max
Component from scoring (C): ≥ 1 mm
Scoring angle θ: ≥ 20˚ (typical)
Max. component height (D): 32 mm
Depaneling Mode: Motorized
Separating Speed: 200, 350, 400 or 450 mm/s
Production Rate: Moderate to high volume
Scoring Angle: 20˚
Minimum Component Distance from V-Groove: 1 mm
Maximum Component Height: 32 mm (1.26")
PCB Materials: FR4, CEM3, etc.
Processing table: 500 x 165 mm (19.7" x 6.5")
Dimensions (L x W x H): 750 mm x 346 mm x 465 mm (29.5" x 13.6" x 18.4")
Net Weight: 46 kg (102 lbs)
Shipping Weight: 75 kg (166 lbs)
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