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Inspection Capabilities
Field-of-View (FOV): 8.2 x 6.8mm (0.32 x 0.27 in.) (1X)
Resolution: 3.4µm (1X)
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imaging: 5-megapixel color camera (2448 × 2048)
Optics: Proprietary high resolution, low distortion with coaxial illumination and optional FV Metrology module
AFVM - Metrology module: FVM - Focus Variation Measurement sensor
Device types: JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, waffle packs
Defects Detected
Wires: Missing, damaged, no stick, off pad, club foot, lifted
Die: Missing, wrong, polarity, chipped, cracked, contamination
Part: Position, missing, wrong, polarity, skew, tombstone
Epoxy: Contamination, insufficient, excessive, bridging
Solder: Contamination, insufficient, excessive, bridging
Vision Technology
Image processing: Autonomous Image Interpretation (AI2) Technology, OCV, OCR, Barcode Recognition, Wire Trace Inspection, both image and rule-based algorithms.
Programming Time: <13 minutes (for established libraries)
CAD Import: Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation
Conveyor Specifications
Panel Maximum Size: 440 x 450 mm (17.3 x 17.7 in.)
Panel Minimum Size: 50 x 50 mm (2 x 2 in.)
Panel Edge Clearance: 3 mm (0.12 in.)
Panel Thickness: 0.1 to 7.0 mm
Panel Maximum Weight: 3.0 kg (6.6 lbs)
Height Clearance Top: 19mm (0.75 in.) (Z stroke of 50mm); Bottom: 50mm (2 in.)
Conveyor height: 930 - 980 mm (36.6 - 38.6 in.) (Configurable to 880 - 950 mm)
Conveyor Length: 1,100mm (43.3 in.)
Conveyor Direction: Left to Right (Configurable to Right to Left)
System Specifications
System Dimensions: 110 x 128 x 143 cm (W x D x H) Height excludes signal-light pole and levelling feet
Weight ≈ 965 kg (2127 lbs.)
Machine Interface: SMEMA, Hermes, Pass/Fail Signal, RS232 and Ethernet
Power Requirements: 100-120 VAC or 220-240 VAC, 50/60 hz, 10-15 amps
Compressed Air Requirements: 5.6 to 7.0 Kgf/cm² (80 to 100 psi @ 4 cfm) OS Windows 10
Options
SPC software, Barcode Readers (1D/2D), Programming Software: ePM-AI, Offline Defect Review, Certification Target, CMM Capability, AI Capability, Secondary optics (5X or 10X), Tertiary optics (0.5X).
