NXP MF1SEP1031DUD/03V 安全非接触式智能卡IC晶圆

Type: Secure Contactless Smart Card IC

Package: Wafer

Category: Secure Contactless Smart Card IC

Mounting: Surface Mount

Rad Hard: No

Screening Level: Commercial

Supplier Package: WAFER

Operating Temperature: -25 to 70 °C

Operating Temperature Max: 70 °C

Operating Temperature Min: -25 °C