NXP UJA1075ATW/3V3,118 系统基础芯片

Type: High-speed CAN/LIN Core System

Package: 32HTSSOP

Category: High-speed CAN/LIN Core System

Mounting: Surface Mount

Rad Hard: No

MSL Level: MSL 1 - Unlimited

Pin Count: 32

Lead Finish: Gold

Supplier Package: HTSSOP

Maximum Data Rate: 1 Mbps

Power Supply Type: Analog

Product Dimensions: 11.1 x 6.2 x 0.95 mm

Max Processing Temp: 260

Operating Temperature: -40 to 125 °C

Operating Supply Current: 0.083 mA

Datasheet